The following companies make IC packages or components that could be used packaging prototype devices.

Prototype Packages
  • Evergreen Semiconductor Materials, Inc
  • Mirror Semiconductor
  • Quik-Pak
  • SEMPAC’s “Open-Pak” Technology

Packages
  • Kyocera
  • NTK Technologies Incorporated
  • Shinko
  • Stratedge

Submounts & Transmission lines
  • Applied Thin-Film Products

Solder Paste and Preforms
  • Almit
  • Alpha
  • Indium Corporation
  • Kester

The original document is available at https://www.p-brane.com/nano/IC+Packaging